Vulnerabilities > Qualcomm > Sd855 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
| 2023-12-05 | CVE-2023-33070 | Improper Authentication vulnerability in Qualcomm products Transient DOS in Automotive OS due to improper authentication to the secure IO calls. | 5.5 |
| 2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
| 2023-12-05 | CVE-2023-33088 | NULL Pointer Dereference vulnerability in Qualcomm products Memory corruption when processing cmd parameters while parsing vdev. | 7.8 |
| 2023-12-05 | CVE-2023-33092 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size. | 7.8 |
| 2023-12-05 | CVE-2023-33107 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call. | 7.8 |
| 2023-11-07 | CVE-2023-22388 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Multi-mode Call Processor while processing bit mask API. | 9.8 |
| 2023-11-07 | CVE-2023-24852 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core due to secure memory access by user while loading modem image. | 7.8 |
| 2023-11-07 | CVE-2023-28545 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while loading an app ELF. | 7.8 |
| 2023-11-07 | CVE-2023-28554 | Unspecified vulnerability in Qualcomm products Information Disclosure in Qualcomm IPC while reading values from shared memory in VM. | 5.5 |