Vulnerabilities > Qualcomm > Sd855 Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-12-05 CVE-2023-33022 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in HLOS while invoking IOCTL calls from user-space.
local
low complexity
qualcomm CWE-190
7.8
2023-12-05 CVE-2023-33024 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption while sending SMS from AP firmware.
local
low complexity
qualcomm CWE-120
7.8
2023-12-05 CVE-2023-33042 Improper Input Validation vulnerability in Qualcomm products
Transient DOS in Modem after RRC Setup message is received.
network
low complexity
qualcomm CWE-20
7.5
2023-12-05 CVE-2023-33044 Reachable Assertion vulnerability in Qualcomm products
Transient DOS in Data modem while handling TLB control messages from the Network.
network
low complexity
qualcomm CWE-617
7.5
2023-12-05 CVE-2023-33054 Improper Authentication vulnerability in Qualcomm products
Cryptographic issue in GPS HLOS Driver while downloading Qualcomm GNSS assistance data.
network
low complexity
qualcomm CWE-287
critical
9.1
2023-12-05 CVE-2023-33063 Use After Free vulnerability in Qualcomm products
Memory corruption in DSP Services during a remote call from HLOS to DSP.
local
low complexity
qualcomm CWE-416
7.8
2023-12-05 CVE-2023-33070 Improper Authentication vulnerability in Qualcomm products
Transient DOS in Automotive OS due to improper authentication to the secure IO calls.
local
low complexity
qualcomm CWE-287
5.5
2023-12-05 CVE-2023-33080 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.
network
low complexity
qualcomm CWE-125
7.5
2023-12-05 CVE-2023-33088 NULL Pointer Dereference vulnerability in Qualcomm products
Memory corruption when processing cmd parameters while parsing vdev.
local
low complexity
qualcomm CWE-476
7.8
2023-12-05 CVE-2023-33092 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size.
local
low complexity
qualcomm CWE-119
7.8