Vulnerabilities > Qualcomm > SD 652 > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-05-06 | CVE-2017-18157 | Use After Free vulnerability in Qualcomm products A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | 7.2 |
| 2019-04-04 | CVE-2018-11966 | Improper Input Validation vulnerability in Qualcomm products Undefined behavior in UE while processing unknown IEI in OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SM7150, Snapdragon_High_Med_2016, SXR1130 | 7.2 |
| 2019-02-25 | CVE-2018-11931 | Improper Input Validation vulnerability in Qualcomm products Improper access to HLOS is possible while transferring memory to CPZ in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in versions MDM9150, MDM9206, MDM9607, MDM9650, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | 7.2 |
| 2019-02-25 | CVE-2018-11289 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Data truncation during higher to lower type conversion which causes less memory allocation than desired can lead to a buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | 7.2 |
| 2019-02-11 | CVE-2018-13888 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605. | 7.2 |
| 2019-02-11 | CVE-2018-11888 | Missing Authorization vulnerability in Qualcomm products Unauthorized access may be allowed by the SCP11 Crypto Services TA will processing commands from other TA in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile and Snapdragon Voice & Music in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439, Snapdragon_High_Med_2016. | 7.2 |
| 2019-02-11 | CVE-2018-11847 | Improper Input Validation vulnerability in Qualcomm products Malicious TA can tag QSEE kernel memory and map to EL0, there by corrupting the physical memory as well it can be used to corrupt the QSEE kernel and compromise the whole TEE in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables and Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9206, MDM9607, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCA8081, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 650/52, SD 820, SD 820A, SD 835, SD 8CX, SDM439 and Snapdragon_High_Med_2016 | 7.2 |
| 2019-01-18 | CVE-2018-5867 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130 | 7.2 |
| 2019-01-18 | CVE-2018-11279 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Lack of check of input size can make device memory get corrupted because of buffer overflow in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130 | 8.3 |
| 2019-01-03 | CVE-2017-18330 | Unspecified vulnerability in Qualcomm products Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | 7.2 |