Vulnerabilities > CVE-2017-18157 - Use After Free vulnerability in Qualcomm products

CVSS 7.2 - HIGH

Attack vector

LOCAL

Attack complexity

LOW

Privileges required

NONE

Confidentiality impact

COMPLETE

Integrity impact

COMPLETE

Availability impact

COMPLETE

local

low complexity

qualcomm

CWE-416

NVD

Published: 2019-05-06

Updated: 2019-05-07

Summary

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Vulnerable Configurations

Part	Description	Count
OS	Qualcomm Qualcomm Mdm9206 Firmware - Qualcomm Mdm9607 Firmware - Qualcomm Mdm9650 Firmware - Qualcomm Msm8909W Firmware - Qualcomm Msm8996Au Firmware - Qualcomm SD 210 Firmware - Qualcomm SD 212 Firmware - Qualcomm SD 205 Firmware - Qualcomm SD 425 Firmware - Qualcomm SD 450 Firmware - Qualcomm SD 615 Firmware - Qualcomm SD 616 Firmware - Qualcomm SD 415 Firmware - Qualcomm SD 625 Firmware - Qualcomm SD 650 Firmware - Qualcomm SD 652 Firmware - Qualcomm SD 820 Firmware - Qualcomm SD 820A Firmware - Qualcomm SD 835 Firmware - Qualcomm SD 845 Firmware - Qualcomm Sdx20 Firmware -	21
Hardware	Qualcomm Qualcomm Mdm9206 - Qualcomm Mdm9607 - Qualcomm Mdm9650 - Qualcomm Msm8909W - Qualcomm Msm8996Au - Qualcomm SD 210 - Qualcomm SD 212 - Qualcomm SD 205 - Qualcomm SD 425 - Qualcomm SD 450 - Qualcomm SD 615 - Qualcomm SD 616 - Qualcomm SD 415 - Qualcomm SD 625 - Qualcomm SD 650 - Qualcomm SD 652 - Qualcomm SD 820 - Qualcomm SD 820A - Qualcomm SD 835 - Qualcomm SD 845 - Qualcomm Sdx20 -	21

Common Weakness Enumeration (CWE)

CWE-416 - Use After Free

References

https://www.qualcomm.com/company/product-security/bulletins