Vulnerabilities > Qualcomm > Wsa8830 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-06-14 | CVE-2021-35098 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Improper validation of session id in PCM routing process can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2022-06-14 | CVE-2021-35111 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper validation of tag id while RRC sending tag id to MAC can lead to TOCTOU race condition in Snapdragon Connectivity, Snapdragon Mobile | 5.9 |
| 2022-06-14 | CVE-2021-35118 | Out-of-bounds Write vulnerability in Qualcomm products An out-of-bounds write can occur due to an incorrect input check in the camera driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2022-06-14 | CVE-2021-35119 | Out-of-bounds Read vulnerability in Qualcomm products Potential out of Bounds read in FIPS event processing due to improper validation of the length from the firmware in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 5.5 |
| 2022-06-14 | CVE-2021-35120 | Use After Free vulnerability in Qualcomm products Improper handling between export and release functions on the same handle from client can lead to use after free in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |
| 2022-06-14 | CVE-2021-35121 | Improper Validation of Array Index vulnerability in Qualcomm products An array index is improperly used to lock and unlock a mutex which can lead to a Use After Free condition In the Synx driver in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |
| 2022-04-01 | CVE-2021-30331 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper data validation of external commands sent via DIAG interface in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-02-11 | CVE-2021-30324 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2022-01-13 | CVE-2021-30313 | Use After Free vulnerability in Qualcomm products Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.4 |
| 2022-01-13 | CVE-2021-30314 | Information Exposure vulnerability in Qualcomm products Lack of validation for third party application accessing the service can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |