Vulnerabilities > Qualcomm > Wcn7851 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-06-14 | CVE-2021-35085 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer overflow due to lack of buffer length check during management frame Rx handling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.1 |
| 2022-06-14 | CVE-2021-35090 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Possible hypervisor memory corruption due to TOC TOU race condition when updating address mappings in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-06-14 | CVE-2021-35092 | Improper Input Validation vulnerability in Qualcomm products Processing DCB/AVB algorithm with an invalid queue index from IOCTL request could lead to arbitrary address modification in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.7 |
| 2022-06-14 | CVE-2021-35094 | Improper Authentication vulnerability in Qualcomm products Improper verification of timeout-based authentication in identity credential can lead to invalid authorization in HLOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-06-14 | CVE-2021-35102 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of validation for the length of NAI string read from EFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile | 7.8 |
| 2022-06-14 | CVE-2021-35111 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper validation of tag id while RRC sending tag id to MAC can lead to TOCTOU race condition in Snapdragon Connectivity, Snapdragon Mobile | 5.9 |
| 2022-06-14 | CVE-2021-35116 | Improper Input Validation vulnerability in Qualcomm products APK can load a crafted model into the CDSP which can lead to a compromise of CDSP and other APK`s data executing there in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.1 |
| 2022-06-14 | CVE-2021-35118 | Out-of-bounds Write vulnerability in Qualcomm products An out-of-bounds write can occur due to an incorrect input check in the camera driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2022-06-14 | CVE-2021-35119 | Out-of-bounds Read vulnerability in Qualcomm products Potential out of Bounds read in FIPS event processing due to improper validation of the length from the firmware in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 5.5 |
| 2022-06-14 | CVE-2021-35120 | Use After Free vulnerability in Qualcomm products Improper handling between export and release functions on the same handle from client can lead to use after free in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |