Vulnerabilities > Qualcomm > Wcn7850 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2022-06-14 | CVE-2021-35090 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Possible hypervisor memory corruption due to TOC TOU race condition when updating address mappings in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
2022-06-14 | CVE-2021-35094 | Improper Authentication vulnerability in Qualcomm products Improper verification of timeout-based authentication in identity credential can lead to invalid authorization in HLOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
2022-06-14 | CVE-2021-35116 | Improper Input Validation vulnerability in Qualcomm products APK can load a crafted model into the CDSP which can lead to a compromise of CDSP and other APK`s data executing there in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.1 |
2022-06-14 | CVE-2022-22057 | Race Condition vulnerability in Qualcomm products Use after free in graphics fence due to a race condition while closing fence file descriptor and destroy graphics timeline simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
2022-06-14 | CVE-2022-22064 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of size validation while unpacking frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
2022-06-14 | CVE-2022-22065 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read in WLAN HOST due to improper length check can lead to DOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
2022-06-14 | CVE-2022-22068 | Use After Free vulnerability in Qualcomm products kernel event may contain unexpected content which is not generated by NPU software in asynchronous execution mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2022-06-14 | CVE-2022-22071 | Use After Free vulnerability in Qualcomm products Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |
2022-06-14 | CVE-2022-22082 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to possible buffer overflow while parsing DSF header with corrupted channel count in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2022-06-14 | CVE-2022-22083 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service due to memory corruption while extracting ape header from clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |