Vulnerabilities > Qualcomm > Wcn3680B Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-02-12 | CVE-2022-33280 | Access of Uninitialized Pointer vulnerability in Qualcomm products Memory corruption due to access of uninitialized pointer in Bluetooth HOST while processing the AVRCP packet. | 8.8 |
2023-02-12 | CVE-2022-40512 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon. | 7.5 |
2023-01-09 | CVE-2022-22088 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote | 8.8 |
2023-01-09 | CVE-2022-25715 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in display driver due to incorrect type casting while accessing the fence structure fields | 7.8 |
2023-01-09 | CVE-2022-25717 | Double Free vulnerability in Qualcomm products Memory corruption in display due to double free while allocating frame buffer memory | 7.8 |
2023-01-09 | CVE-2022-25721 | Type Confusion vulnerability in Qualcomm products Memory corruption in video driver due to type confusion error during video playback | 7.8 |
2023-01-09 | CVE-2022-33266 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Audio due to integer overflow to buffer overflow while music playback of clips like amr,evrc,qcelp with modified content. | 7.8 |
2023-01-09 | CVE-2022-33290 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in Bluetooth HOST due to null pointer dereference when a mismatched argument is passed. | 7.5 |
2023-01-09 | CVE-2022-33299 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS due to null pointer dereference in Bluetooth HOST while receiving an attribute protocol PDU with zero length data. | 7.5 |
2022-12-13 | CVE-2022-25677 | Use After Free vulnerability in Qualcomm products Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |