Vulnerabilities > Qualcomm > Wcn3660B Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-10-20 | CVE-2021-30288 | Out-of-bounds Write vulnerability in Qualcomm products Possible stack overflow due to improper length check of TLV while copying the TLV to a local stack variable in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-10-20 | CVE-2021-30291 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
| 2021-10-20 | CVE-2021-30292 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
| 2021-10-20 | CVE-2021-30297 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound read due to improper validation of packet length while handling data transfer in VR service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.1 |
| 2021-10-20 | CVE-2021-30316 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Possible out of bound memory access due to improper boundary check while creating HSYNC fence in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2021-09-17 | CVE-2021-1947 | Use After Free vulnerability in Qualcomm products Use-after-free vulnerability in kernel graphics driver because of storing an invalid pointer in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-09-17 | CVE-2021-30260 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible Integer overflow to buffer overflow issue can occur due to improper validation of input parameters when extscan hostlist configuration command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-09-17 | CVE-2021-30261 | Improper Input Validation vulnerability in Qualcomm products Possible integer and heap overflow due to lack of input command size validation while handling beacon template update command from HLOS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-09-09 | CVE-2021-1909 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow occurs in trusted applications due to lack of length check of parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-09-09 | CVE-2021-1934 | Double Free vulnerability in Qualcomm products Possible memory corruption due to improper check when application loader object is explicitly destructed while application is unloading in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.8 |