Vulnerabilities > Qualcomm > Wcd9385 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-11-12 | CVE-2021-30264 | Use After Free vulnerability in Qualcomm products Possible use after free due improper validation of reference from call back to internal store table in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2021-11-12 | CVE-2021-30265 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to improper validation of memory address while processing user-space IOCTL for clearing Filter and Route statistics in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
| 2021-11-12 | CVE-2021-30266 | Use After Free vulnerability in Qualcomm products Possible use after free due to improper memory validation when initializing new interface via Interface add command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2021-11-12 | CVE-2021-30284 | Information Exposure vulnerability in Qualcomm products Possible information exposure and denial of service due to NAS not dropping messages when integrity check fails in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.4 |
| 2021-10-20 | CVE-2021-1966 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of length check of source and destination buffer before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 4.6 |
| 2021-10-20 | CVE-2021-1967 | Out-of-bounds Write vulnerability in Qualcomm products Possible stack buffer overflow due to lack of check on the maximum number of post NAN discovery attributes while processing a NAN Match event in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
| 2021-10-20 | CVE-2021-1977 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to improper validation of frame length while processing AEAD decryption during ASSOC response in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music | 6.4 |
| 2021-10-20 | CVE-2021-1980 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of length check while parsing beacon IE response in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.4 |
| 2021-10-20 | CVE-2021-30302 | Improper Authentication vulnerability in Qualcomm products Improper authentication of EAP WAPI EAPOL frames from unauthenticated user can lead to information disclosure in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 5.0 |
| 2021-10-20 | CVE-2021-30304 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer out of bound read can occur due to improper validation of TBTT count and length while parsing the beacon response in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity | 6.4 |