Vulnerabilities > Qualcomm > Ssg2125P Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-11-04 | CVE-2024-23377 | Unspecified vulnerability in Qualcomm products Memory corruption while invoking IOCTL command from user-space, when a user modifies the original packet size of the command after system properties have been already sent to the EVA driver. | 6.7 |
| 2024-11-04 | CVE-2024-33068 | Use After Free vulnerability in Qualcomm products Transient DOS while parsing fragments of MBSSID IE from beacon frame. | 6.5 |
| 2024-11-04 | CVE-2024-38403 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing BTM ML IE when per STA profile is not included. | 6.5 |
| 2024-11-04 | CVE-2024-38405 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing the CU information from RNR IE. | 6.5 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2024-01-02 | CVE-2023-33014 | Improper Input Validation vulnerability in Qualcomm products Information disclosure in Core services while processing a Diag command. | 6.8 |
| 2024-01-02 | CVE-2023-33036 | NULL Pointer Dereference vulnerability in Qualcomm products Permanent DOS in Hypervisor while untrusted VM without PSCI support makes a PSCI call. | 5.5 |
| 2024-01-02 | CVE-2023-33037 | Missing Encryption of Sensitive Data vulnerability in Qualcomm products Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. | 5.5 |
| 2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |