Vulnerabilities > Qualcomm > Ssg2125P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2023-21658 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing the received beacon or probe response frame. | 7.5 |
| 2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |
| 2023-06-06 | CVE-2023-21660 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing FT Information Elements. | 7.5 |
| 2023-06-06 | CVE-2023-21661 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing WLAN beacon or probe-response frame. | 7.5 |
| 2023-06-06 | CVE-2023-21670 | Incorrect Authorization vulnerability in Qualcomm products Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode. | 7.8 |
| 2023-05-02 | CVE-2022-33304 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS due to NULL pointer dereference in Modem while performing pullup for received TCP/UDP packet. | 7.5 |
| 2023-04-13 | CVE-2022-25726 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in modem data due to array out of bound access while handling the incoming DNS response packet | 7.5 |
| 2023-04-13 | CVE-2022-25730 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in modem due to improper check of IP type while processing DNS server query | 7.5 |
| 2023-04-13 | CVE-2022-25739 | NULL Pointer Dereference vulnerability in Qualcomm products Denial of service in modem due to missing null check while processing the ipv6 packet received during ECM call | 7.5 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |