Vulnerabilities > Qualcomm > Snapdragon XR2 5G Platform Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-09-05 CVE-2023-28557 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload.
local
low complexity
qualcomm CWE-129
7.8
2023-09-05 CVE-2023-28558 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in WLAN handler while processing PhyID in Tx status handler.
local
low complexity
qualcomm CWE-787
7.8
2023-08-08 CVE-2023-28537 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption while allocating memory in COmxApeDec module in Audio.
local
low complexity
qualcomm CWE-787
7.8
2023-08-08 CVE-2023-28555 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS in Audio while remapping channel buffer in media codec decoding.
network
low complexity
qualcomm CWE-125
7.5
2023-06-06 CVE-2022-22060 Reachable Assertion vulnerability in Qualcomm products
Assertion occurs while processing Reconfiguration message due to improper validation
network
low complexity
qualcomm CWE-617
7.5
2023-06-06 CVE-2022-33227 Double Free vulnerability in Qualcomm products
Memory corruption in Linux android due to double free while calling unregister provider after register call.
local
low complexity
qualcomm CWE-415
7.8
2023-06-06 CVE-2022-33251 Reachable Assertion vulnerability in Qualcomm products
Transient DOS due to reachable assertion in Modem because of invalid network configuration.
network
low complexity
qualcomm CWE-617
7.5
2023-06-06 CVE-2022-33264 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.
local
low complexity
qualcomm CWE-787
7.8
2023-06-06 CVE-2022-33267 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Linux while sending DRM request.
local
low complexity
qualcomm CWE-787
7.8
2023-06-06 CVE-2022-33307 Double Free vulnerability in Qualcomm products
Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed.
local
low complexity
qualcomm CWE-415
7.8