Vulnerabilities > Qualcomm > Snapdragon XR2 5G Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-28567 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28573 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while parsing WMI command parameters. | 7.8 |
| 2023-09-05 | CVE-2023-28581 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN Firmware while parsing receieved GTK Keys in GTK KDE. | 9.8 |
| 2023-09-05 | CVE-2023-33015 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while interpreting MBSSID IE of a received beacon frame. | 7.5 |
| 2023-09-05 | CVE-2023-33021 | Use After Free vulnerability in Qualcomm products Memory corruption in Graphics while processing user packets for command submission. | 7.8 |
| 2023-08-08 | CVE-2023-28575 | Type Confusion vulnerability in Qualcomm products The cam_get_device_priv function does not check the type of handle being returned (device/session/link). | 7.8 |
| 2023-08-08 | CVE-2023-28576 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products The buffer obtained from kernel APIs such as cam_mem_get_cpu_buf() may be readable/writable in userspace after kernel accesses it. | 7.0 |
| 2023-08-08 | CVE-2023-28577 | Use After Free vulnerability in Qualcomm products In the function call related to CAM_REQ_MGR_RELEASE_BUF there is no check if the buffer is being used. | 7.8 |
| 2023-07-04 | CVE-2023-21624 | Unspecified vulnerability in Qualcomm products Information disclosure in DSP Services while loading dynamic module. | 5.5 |
| 2023-07-04 | CVE-2023-21629 | Double Free vulnerability in Qualcomm products Memory Corruption in Modem due to double free while parsing the PKCS15 sim files. | 6.8 |