Vulnerabilities > Qualcomm > Snapdragon W5 GEN 1 Wearable Platform Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-08-08 | CVE-2023-28555 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio while remapping channel buffer in media codec decoding. | 7.5 |
2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
2023-06-06 | CVE-2022-33224 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in core due to buffer copy without check9ing the size of input while processing ioctl queries. | 7.8 |
2023-06-06 | CVE-2022-33227 | Double Free vulnerability in Qualcomm products Memory corruption in Linux android due to double free while calling unregister provider after register call. | 7.8 |
2023-06-06 | CVE-2022-33230 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in FM Host due to buffer copy without checking the size of input in FM Host | 7.8 |
2023-06-06 | CVE-2022-33263 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in Core when multiple DCI clients register and deregister. | 7.8 |
2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
2023-06-06 | CVE-2022-40529 | Incorrect Authorization vulnerability in Qualcomm products Memory corruption due to improper access control in kernel while processing a mapping request from root process. | 7.8 |