Vulnerabilities > Qualcomm > Snapdragon W5 GEN 1 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-09-02 | CVE-2024-33045 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when BTFM client sends new messages over Slimbus to ADSP. | 7.8 |
2023-09-05 | CVE-2023-28564 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while passing command parameters through WMI interfaces. | 7.8 |
2023-09-05 | CVE-2023-28565 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command streams through WMI interfaces. | 7.8 |
2023-09-05 | CVE-2023-28567 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command through WMI interfaces. | 7.8 |
2023-09-05 | CVE-2023-33021 | Use After Free vulnerability in Qualcomm products Memory corruption in Graphics while processing user packets for command submission. | 7.8 |
2023-08-08 | CVE-2023-28575 | Type Confusion vulnerability in Qualcomm products The cam_get_device_priv function does not check the type of handle being returned (device/session/link). | 7.8 |
2023-07-04 | CVE-2023-21633 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Linux while processing QcRilRequestImsRegisterMultiIdentityMessage request. | 7.8 |
2023-07-04 | CVE-2023-21635 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Data Network Stack & Connectivity when sim gets detected on telephony. | 7.8 |
2023-07-04 | CVE-2023-21637 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Linux while calling system configuration APIs. | 7.8 |
2023-07-04 | CVE-2023-21639 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing sva_model_serializer using memory size passed by HIDL client. | 7.8 |