Vulnerabilities > Qualcomm > Snapdragon 820 Automotive Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
| 2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |
| 2023-06-06 | CVE-2023-21632 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive GPU while querying a gsl memory node. | 7.8 |
| 2023-06-06 | CVE-2023-21657 | Improper Input Validation vulnerability in Qualcomm products Memoru corruption in Audio when ADSP sends input during record use case. | 7.8 |
| 2023-05-02 | CVE-2023-21665 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Graphics while importing a file. | 7.8 |
| 2023-05-02 | CVE-2023-21666 | Memory Leak vulnerability in Qualcomm products Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool. | 7.8 |
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |
| 2023-04-13 | CVE-2022-40503 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming. | 7.5 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |