Vulnerabilities > Qualcomm > Snapdragon 8 GEN 3 Mobile Platform Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |
| 2024-02-06 | CVE-2023-33076 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. | 7.8 |
| 2024-02-06 | CVE-2023-43522 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while key unwrapping process, when the given encrypted key is empty or NULL. | 7.5 |
| 2024-02-06 | CVE-2023-43523 | Reachable Assertion vulnerability in Qualcomm products Transient DOS while processing 11AZ RTT management action frame received through OTA. | 7.5 |
| 2024-02-06 | CVE-2023-43533 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. | 7.5 |
| 2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
| 2024-02-06 | CVE-2023-33049 | Memory Leak vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage. | 7.5 |
| 2024-02-06 | CVE-2023-33057 | Improper Input Validation vulnerability in Qualcomm products Transient DOS in Multi-Mode Call Processor while processing UE policy container. | 7.5 |
| 2024-02-06 | CVE-2023-33058 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Modem while processing SIB5. | 9.1 |
| 2024-02-06 | CVE-2023-33060 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Core when DDR memory check is called while DDR is not initialized. | 5.5 |