Vulnerabilities > Qualcomm > Snapdragon 8 GEN 3 Mobile Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33048 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the received TID-to-link mapping element of beacon/probe response frame. | 7.5 |
| 2024-09-02 | CVE-2024-33052 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when user provides data for FM HCI command control operations. | 7.8 |
| 2024-09-02 | CVE-2024-33054 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption during the handshake between the Primary Virtual Machine and Trusted Virtual Machine. | 7.8 |
| 2024-09-02 | CVE-2024-33057 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing the multi-link element Control field when common information length check is missing before updating the location. | 7.5 |
| 2024-09-02 | CVE-2024-33060 | Use After Free vulnerability in Qualcomm products Memory corruption when two threads try to map and unmap a single node simultaneously. | 7.8 |
| 2024-09-02 | CVE-2024-38402 | Use After Free vulnerability in Qualcomm products Memory corruption while processing IOCTL call for getting group info. | 7.8 |