Vulnerabilities > Qualcomm > Snapdragon 7C GEN 3 Compute Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-12-05 | CVE-2023-33088 | NULL Pointer Dereference vulnerability in Qualcomm products Memory corruption when processing cmd parameters while parsing vdev. | 7.8 |
2023-12-05 | CVE-2023-33089 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS when processing a NULL buffer while parsing WLAN vdev. | 7.5 |
2023-12-05 | CVE-2023-33092 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while processing pin reply in Bluetooth, when pin code received from APP layer is greater than expected size. | 7.8 |
2023-12-05 | CVE-2023-33098 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing WPA IES, when it is passed with length more than expected size. | 7.5 |
2023-12-05 | CVE-2023-33106 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while submitting a large list of sync points in an AUX command to the IOCTL_KGSL_GPU_AUX_COMMAND. | 7.8 |
2023-12-05 | CVE-2023-33107 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call. | 7.8 |
2023-11-07 | CVE-2023-21671 | Unspecified vulnerability in Qualcomm products Memory Corruption in Core during syscall for Sectools Fuse comparison feature. | 7.8 |
2023-11-07 | CVE-2023-24852 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core due to secure memory access by user while loading modem image. | 7.8 |
2023-11-07 | CVE-2023-28545 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while loading an app ELF. | 7.8 |
2023-11-07 | CVE-2023-28556 | Unspecified vulnerability in Qualcomm products Cryptographic issue in HLOS during key management. | 7.8 |