Vulnerabilities > Qualcomm > Sm7325P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-04-01 | CVE-2021-1942 | Out-of-bounds Write vulnerability in Qualcomm products Improper handling of permissions of a shared memory region can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2022-04-01 | CVE-2021-1950 | Improper Authentication vulnerability in Qualcomm products Improper cleaning of secure memory between authenticated users can lead to face authentication bypass in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2022-04-01 | CVE-2021-30329 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of TCI configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-04-01 | CVE-2021-35103 | Out-of-bounds Write vulnerability in Qualcomm products Possible out of bound write due to improper validation of number of timer values received from firmware while syncing timers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2022-04-01 | CVE-2021-35105 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Possible out of bounds access due to improper input validation during graphics profiling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2022-04-01 | CVE-2021-35106 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to improper length calculation of WMI message. | 7.2 |
| 2022-02-11 | CVE-2021-30317 | Improper Authentication vulnerability in Qualcomm products Improper validation of program headers containing ELF metadata can lead to image verification bypass in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2022-02-11 | CVE-2021-30322 | Out-of-bounds Write vulnerability in Qualcomm products Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.2 |
| 2022-02-11 | CVE-2021-35068 | NULL Pointer Dereference vulnerability in Qualcomm products Lack of null check while freeing the device information buffer in the Bluetooth HFP protocol can lead to a NULL pointer dereference in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-02-11 | CVE-2021-35069 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper validation of data length received from DMA buffer can lead to memory corruption. | 7.2 |