Vulnerabilities > Qualcomm > Sm7325P Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-06-14 | CVE-2022-22068 | Use After Free vulnerability in Qualcomm products kernel event may contain unexpected content which is not generated by NPU software in asynchronous execution mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22071 | Use After Free vulnerability in Qualcomm products Possible use after free when process shell memory is freed using IOCTL munmap call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |
| 2022-06-14 | CVE-2022-22082 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to possible buffer overflow while parsing DSF header with corrupted channel count in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22083 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service due to memory corruption while extracting ape header from clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2022-22084 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when extracting qcp audio file due to lack of check on data length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22085 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in video due to buffer overflow while reading the dts file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-04-01 | CVE-2021-1942 | Out-of-bounds Write vulnerability in Qualcomm products Improper handling of permissions of a shared memory region can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2022-04-01 | CVE-2021-1950 | Improper Authentication vulnerability in Qualcomm products Improper cleaning of secure memory between authenticated users can lead to face authentication bypass in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-04-01 | CVE-2021-30329 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of TCI configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2022-04-01 | CVE-2021-30332 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of OTA configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |