Vulnerabilities > Qualcomm > Sm7325P Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-06-06 | CVE-2023-21657 | Improper Input Validation vulnerability in Qualcomm products Memoru corruption in Audio when ADSP sends input during record use case. | 7.8 |
2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |
2023-06-06 | CVE-2023-21670 | Incorrect Authorization vulnerability in Qualcomm products Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode. | 7.8 |
2023-05-02 | CVE-2022-40504 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network. | 7.5 |
2023-05-02 | CVE-2022-33305 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS due to NULL pointer dereference in Modem while sending invalid messages in DCCH. | 7.5 |
2023-05-02 | CVE-2022-34144 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem during OSI decode scheduling. | 7.5 |
2023-05-02 | CVE-2023-21665 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Graphics while importing a file. | 7.8 |
2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
2023-04-13 | CVE-2022-33288 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information. | 8.8 |
2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |