Vulnerabilities > Qualcomm > Sm7325P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-09-16 | CVE-2022-25669 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service in video due to buffer over read while parsing MP4 clip in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-09-16 | CVE-2022-25686 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in video module due to buffer overflow while processing WAV file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 9.8 |
| 2022-09-16 | CVE-2022-25688 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in video due to buffer overflow while parsing ps video clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2022-09-16 | CVE-2022-25690 | Improper Validation of Array Index vulnerability in Qualcomm products Information disclosure in WLAN due to improper validation of array index while parsing crafted ANQP action frames in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.5 |
| 2022-09-16 | CVE-2022-25696 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in display due to time-of-check time-of-use race condition during map or unmap in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.0 |
| 2022-09-16 | CVE-2022-25706 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Bluetooth driver due to buffer over-read while reading l2cap length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2022-09-02 | CVE-2021-35097 | Improper Verification of Cryptographic Signature vulnerability in Qualcomm products Possible authentication bypass due to improper order of signature verification and hashing in the signature verification call in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.8 |
| 2022-09-02 | CVE-2021-35122 | Improper Input Validation vulnerability in Qualcomm products Non-secure region can try modifying RG permissions of IO space xPUs due to improper input validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-02 | CVE-2021-35132 | Improper Validation of Specified Quantity in Input vulnerability in Qualcomm products Out of bound write in DSP service due to improper bound check for response buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-02 | CVE-2021-35134 | Incorrect Calculation of Buffer Size vulnerability in Qualcomm products Due to insufficient validation of ELF headers, an Incorrect Calculation of Buffer Size can occur in Boot leading to memory corruption in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 8.4 |