Vulnerabilities > Qualcomm > Sm7325P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2023-21656 | Improper Input Validation vulnerability in Qualcomm products Memory corruption in WLAN HOST while receiving an WMI event from firmware. | 7.8 |
| 2023-06-06 | CVE-2023-21657 | Improper Input Validation vulnerability in Qualcomm products Memoru corruption in Audio when ADSP sends input during record use case. | 7.8 |
| 2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |
| 2023-06-06 | CVE-2023-21670 | Incorrect Authorization vulnerability in Qualcomm products Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode. | 7.8 |
| 2023-05-02 | CVE-2022-40504 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network. | 7.5 |
| 2023-05-02 | CVE-2022-33305 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS due to NULL pointer dereference in Modem while sending invalid messages in DCCH. | 7.5 |
| 2023-05-02 | CVE-2022-34144 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem during OSI decode scheduling. | 7.5 |
| 2023-05-02 | CVE-2023-21665 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Graphics while importing a file. | 7.8 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
| 2023-04-13 | CVE-2022-33270 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Transient DOS due to time-of-check time-of-use race condition in Modem while processing RRC Reconfiguration message. | 5.9 |