Vulnerabilities > Qualcomm > Sm7315 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-06-14 | CVE-2021-35130 | Use After Free vulnerability in Qualcomm products Memory corruption in graphics support layer due to use after free condition in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22057 | Race Condition vulnerability in Qualcomm products Use after free in graphics fence due to a race condition while closing fence file descriptor and destroy graphics timeline simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22065 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read in WLAN HOST due to improper length check can lead to DOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2022-22068 | Use After Free vulnerability in Qualcomm products kernel event may contain unexpected content which is not generated by NPU software in asynchronous execution mode in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22082 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to possible buffer overflow while parsing DSF header with corrupted channel count in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22083 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service due to memory corruption while extracting ape header from clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2022-22084 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when extracting qcp audio file due to lack of check on data length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2022-22085 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in video due to buffer overflow while reading the dts file in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-04-01 | CVE-2021-30328 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of invalid NR CSI-IM resource configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2022-04-01 | CVE-2021-30329 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of TCI configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |