Vulnerabilities > Qualcomm > Sm7315 Firmware

DATE CVE VULNERABILITY TITLE RISK
2022-02-11 CVE-2021-35069 Integer Overflow or Wraparound vulnerability in Qualcomm products
Improper validation of data length received from DMA buffer can lead to memory corruption.
local
low complexity
qualcomm CWE-190
7.2
2022-02-11 CVE-2021-35075 NULL Pointer Dereference vulnerability in Qualcomm products
Possible null pointer dereference due to lack of WDOG structure validation during registration in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-476
7.2
2022-02-11 CVE-2021-35077 Use After Free vulnerability in Qualcomm products
Possible use after free scenario in compute offloads to DSP while multiple calls spawn a dynamic process in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-416
7.2
2022-01-13 CVE-2021-30287 Reachable Assertion vulnerability in Qualcomm products
Possible assertion due to improper validation of symbols configured for PDCCH monitoring in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
network
low complexity
qualcomm CWE-617
5.0
2022-01-13 CVE-2021-30307 Reachable Assertion vulnerability in Qualcomm products
Possible denial of service due to improper validation of DNS response when DNS client requests with PTR, NAPTR or SRV query type in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT
network
low complexity
qualcomm CWE-617
5.0
2022-01-13 CVE-2021-30311 Improper Validation of Array Index vulnerability in Qualcomm products
Possible heap overflow due to lack of index validation before allocating and writing to heap buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-129
7.8
2022-01-13 CVE-2021-30313 Use After Free vulnerability in Qualcomm products
Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
4.4
2022-01-13 CVE-2021-30314 Information Exposure vulnerability in Qualcomm products
Lack of validation for third party application accessing the service can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-200
5.5
2022-01-13 CVE-2021-30319 Integer Overflow or Wraparound vulnerability in Qualcomm products
Possible integer overflow due to improper validation of command length parameters while processing WMI command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
local
low complexity
qualcomm CWE-190
7.2
2022-01-13 CVE-2021-30330 NULL Pointer Dereference vulnerability in Qualcomm products
Possible null pointer dereference due to improper validation of APE clip in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-476
5.0