Vulnerabilities > Qualcomm > Sm7250P Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2022-01-03 CVE-2021-30278 Improper Input Validation vulnerability in Qualcomm products
Improper input validation in TrustZone memory transfer interface can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-20
5.5
2022-01-03 CVE-2021-30348 Resource Exhaustion vulnerability in Qualcomm products
Improper validation of LLM utility timers availability can lead to denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
low complexity
qualcomm CWE-400
6.5
2021-07-13 CVE-2021-1931 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow due to improper validation of buffer length while processing fast boot commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
local
low complexity
qualcomm CWE-120
6.7
2021-05-07 CVE-2021-1906 Improper Handling of Exceptional Conditions vulnerability in Qualcomm products
Improper handling of address deregistration on failure can lead to new GPU address allocation failure.
local
low complexity
qualcomm CWE-755
5.5
2021-04-07 CVE-2020-11252 Out-of-bounds Read vulnerability in Qualcomm products
Trustzone initialization code will disable xPU`s when memory dumps are enabled and lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-125
5.5
2021-04-07 CVE-2020-11236 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to invalid value of total dimension in the non-histogram type KPI could lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile
local
low complexity
qualcomm CWE-787
5.5
2021-04-07 CVE-2020-11231 Double Free vulnerability in Qualcomm products
Two threads call one or both functions concurrently leading to corruption of pointers and reference counters which in turn can lead to heap corruption in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-415
6.7
2021-03-17 CVE-2020-11308 Improper Validation of Array Index vulnerability in Qualcomm products
Buffer overflow occurs when trying to convert ASCII string to Unicode string if the actual size is more than required in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
low complexity
qualcomm CWE-129
6.8
2021-03-17 CVE-2020-11230 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Potential arbitrary memory corruption when the qseecom driver updates ion physical addresses in the buffer as it exposes a physical address to user land in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
high complexity
qualcomm CWE-367
6.4
2021-03-17 CVE-2020-11221 Information Exposure vulnerability in Qualcomm products
Usage of syscall by non-secure entity can allow extraction of secure QTEE diagnostic information in clear text form due to insufficient checks in the syscall handler and leads to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-200
5.5