Vulnerabilities > Qualcomm > Sm7250P Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-01-13 | CVE-2021-30313 | Use After Free vulnerability in Qualcomm products Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.4 |
| 2022-01-13 | CVE-2021-30314 | Information Exposure vulnerability in Qualcomm products Lack of validation for third party application accessing the service can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-01-03 | CVE-2021-1918 | Exposure of Resource to Wrong Sphere vulnerability in Qualcomm products Improper handling of resource allocation in virtual machines can lead to information exposure in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 6.5 |
| 2022-01-03 | CVE-2021-30278 | Improper Input Validation vulnerability in Qualcomm products Improper input validation in TrustZone memory transfer interface can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2022-01-03 | CVE-2021-30348 | Resource Exhaustion vulnerability in Qualcomm products Improper validation of LLM utility timers availability can lead to denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.5 |
| 2021-07-13 | CVE-2021-1931 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of buffer length while processing fast boot commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.7 |
| 2021-05-07 | CVE-2021-1906 | Unspecified vulnerability in Qualcomm products Improper handling of address deregistration on failure can lead to new GPU address allocation failure. | 5.5 |
| 2021-04-07 | CVE-2020-11252 | Out-of-bounds Read vulnerability in Qualcomm products Trustzone initialization code will disable xPU`s when memory dumps are enabled and lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-04-07 | CVE-2020-11236 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to invalid value of total dimension in the non-histogram type KPI could lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile | 5.5 |
| 2021-04-07 | CVE-2020-11231 | Double Free vulnerability in Qualcomm products Two threads call one or both functions concurrently leading to corruption of pointers and reference counters which in turn can lead to heap corruption in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |