Vulnerabilities > Qualcomm > Sm6250P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-06-14 | CVE-2021-30341 | Out-of-bounds Write vulnerability in Qualcomm products Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 10.0 |
| 2022-06-14 | CVE-2021-30342 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 7.1 |
| 2022-06-14 | CVE-2021-30343 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.1 |
| 2022-06-14 | CVE-2021-30344 | Unspecified vulnerability in Qualcomm products Improper authorization of a replayed LTE security mode command can lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2021-30347 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? right after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 9.3 |
| 2022-06-14 | CVE-2021-30350 | Improper Validation of Specified Quantity in Input vulnerability in Qualcomm products Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2021-35078 | Memory Leak vulnerability in Qualcomm products Possible memory leak due to improper validation of certificate chain length while parsing server certificate chain in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2021-35083 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to improper validation of certificate chain in SSL or Internet key exchange in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.4 |
| 2022-06-14 | CVE-2021-35102 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of validation for the length of NAI string read from EFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile | 7.8 |
| 2022-06-14 | CVE-2021-35104 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper parsing of headers while playing the FLAC audio clip in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 10.0 |