Vulnerabilities > Qualcomm > Sm6225 Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2023-06-06 CVE-2022-22076 Unspecified vulnerability in Qualcomm products
information disclosure due to cryptographic issue in Core during RPMB read request.
local
low complexity
qualcomm
5.5
2023-06-06 CVE-2022-40523 Exposure of Resource to Wrong Sphere vulnerability in Qualcomm products
Information disclosure in Kernel due to indirect branch misprediction.
local
low complexity
qualcomm CWE-668
5.5
2023-06-06 CVE-2022-40533 Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products
Transient DOS due to untrusted Pointer Dereference in core while sending USB QMI request.
local
low complexity
qualcomm CWE-119
5.5
2023-04-13 CVE-2022-33289 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.
low complexity
qualcomm CWE-129
6.8
2022-04-01 CVE-2021-30331 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow due to improper data validation of external commands sent via DIAG interface in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-120
5.5
2022-02-11 CVE-2021-30324 Classic Buffer Overflow vulnerability in Qualcomm products
Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-120
6.7
2022-02-11 CVE-2021-30325 Improper Validation of Array Index vulnerability in Qualcomm products
Possible out of bound access of DCI resources due to lack of validation process and resource allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-129
6.7
2022-01-13 CVE-2021-30313 Use After Free vulnerability in Qualcomm products
Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
high complexity
qualcomm CWE-416
6.4
2022-01-13 CVE-2021-30314 Information Exposure vulnerability in Qualcomm products
Lack of validation for third party application accessing the service can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-200
5.5
2022-01-03 CVE-2021-30278 Improper Input Validation vulnerability in Qualcomm products
Improper input validation in TrustZone memory transfer interface can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-20
5.5