Vulnerabilities > Qualcomm > Sm4350 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-40523 | Exposure of Resource to Wrong Sphere vulnerability in Qualcomm products Information disclosure in Kernel due to indirect branch misprediction. | 5.5 |
| 2023-04-13 | CVE-2022-33270 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Transient DOS due to time-of-check time-of-use race condition in Modem while processing RRC Reconfiguration message. | 5.9 |
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2021-02-22 | CVE-2020-3664 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read access in hypervisor due to an invalid read access attempt by passing invalid addresses in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.0 |
| 2021-02-22 | CVE-2020-11198 | Improper Cross-boundary Removal of Sensitive Data vulnerability in Qualcomm products Key material used for TZ diag buffer encryption and other data related to log buffer is not wiped securely due to improper usage of memset in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.7 |