Vulnerabilities > Qualcomm > Sm4350 Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-12-05 CVE-2023-33018 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption while using the UIM diag command to get the operators name.
local
low complexity
qualcomm CWE-190
7.8
2023-12-05 CVE-2023-33022 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in HLOS while invoking IOCTL calls from user-space.
local
low complexity
qualcomm CWE-190
7.8
2023-12-05 CVE-2023-33042 Improper Input Validation vulnerability in Qualcomm products
Transient DOS in Modem after RRC Setup message is received.
network
low complexity
qualcomm CWE-20
7.5
2023-12-05 CVE-2023-33043 Reachable Assertion vulnerability in Qualcomm products
Transient DOS in Modem when a Beam switch request is made with a non-configured BWP.
network
low complexity
qualcomm CWE-617
7.5
2023-12-05 CVE-2023-33044 Reachable Assertion vulnerability in Qualcomm products
Transient DOS in Data modem while handling TLB control messages from the Network.
network
low complexity
qualcomm CWE-617
7.5
2023-12-05 CVE-2023-33054 Improper Authentication vulnerability in Qualcomm products
Cryptographic issue in GPS HLOS Driver while downloading Qualcomm GNSS assistance data.
network
low complexity
qualcomm CWE-287
critical
9.1
2023-12-05 CVE-2023-33063 Use After Free vulnerability in Qualcomm products
Memory corruption in DSP Services during a remote call from HLOS to DSP.
local
low complexity
qualcomm CWE-416
7.8
2023-12-05 CVE-2023-33080 Out-of-bounds Read vulnerability in Qualcomm products
Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame.
network
low complexity
qualcomm CWE-125
7.5
2023-11-07 CVE-2023-33031 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.
local
low complexity
qualcomm CWE-787
7.8
2023-11-07 CVE-2023-33059 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in Audio while processing the VOC packet data from ADSP.
local
low complexity
qualcomm CWE-787
7.8