Vulnerabilities > Qualcomm > Sm4350 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
2023-10-03 | CVE-2023-33029 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Service during a remote call from HLOS to DSP. | 7.8 |
2023-10-03 | CVE-2023-33035 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption while invoking callback function of AFE from ADSP. | 7.8 |
2023-09-05 | CVE-2022-33275 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in WLAN HAL when received lm_itemNum is out of range. | 7.8 |
2023-09-05 | CVE-2023-28560 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. | 7.8 |
2023-08-08 | CVE-2023-28555 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio while remapping channel buffer in media codec decoding. | 7.5 |
2023-06-06 | CVE-2022-22060 | Reachable Assertion vulnerability in Qualcomm products Assertion occurs while processing Reconfiguration message due to improper validation | 7.5 |
2023-06-06 | CVE-2022-33230 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in FM Host due to buffer copy without checking the size of input in FM Host | 7.8 |
2023-06-06 | CVE-2022-33251 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem because of invalid network configuration. | 7.5 |
2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |