Vulnerabilities > Qualcomm > Sdx24 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-02-11 | CVE-2021-30322 | Out-of-bounds Write vulnerability in Qualcomm products Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.2 |
| 2022-02-11 | CVE-2021-30323 | Classic Buffer Overflow vulnerability in Qualcomm products Improper validation of maximum size of data write to EFS file can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2022-01-13 | CVE-2021-30308 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.2 |
| 2022-01-13 | CVE-2021-30319 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow due to improper validation of command length parameters while processing WMI command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.2 |
| 2022-01-03 | CVE-2021-1894 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products Improper access control in TrustZone due to improper error handling while handling the signing key in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2022-01-03 | CVE-2021-30262 | Use After Free vulnerability in Qualcomm products Improper validation of a socket state when socket events are being sent to clients can lead to invalid access of memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-01-03 | CVE-2021-30268 | Classic Buffer Overflow vulnerability in Qualcomm products Possible heap Memory Corruption Issue due to lack of input validation when sending HWTC IQ Capture command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2022-01-03 | CVE-2021-30269 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer dereference due to lack of TLB validation for user provided address in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2022-01-03 | CVE-2021-30270 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer dereference in thread profile trap handler due to lack of thread ID validation before dereferencing it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2022-01-03 | CVE-2021-30271 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer dereference in trap handler due to lack of thread ID validation before dereferencing it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |