Vulnerabilities > Qualcomm > Sdm660 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-01-03 | CVE-2017-18330 | Unspecified vulnerability in Qualcomm products Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | 7.2 |
| 2019-01-03 | CVE-2017-18329 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Possible Buffer overflow when transmitting an RTP packet in snapdragon automobile and snapdragon wear in versions MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 835, SD 845 / SD 850, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130 | 7.2 |
| 2019-01-03 | CVE-2017-18328 | Use After Free vulnerability in Qualcomm products Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016. | 7.2 |
| 2019-01-03 | CVE-2017-18326 | Information Exposure vulnerability in Qualcomm products Cryptographic keys are printed in modem debug messages in snapdragon mobile and snapdragon wear in versions MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016. | 2.1 |
| 2019-01-03 | CVE-2017-18320 | Improper Input Validation vulnerability in Qualcomm products QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130. | 7.2 |
| 2019-01-03 | CVE-2017-18141 | Unspecified vulnerability in Qualcomm products When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | 7.2 |
| 2019-01-03 | CVE-2017-11004 | Unspecified vulnerability in Qualcomm products A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | 2.1 |
| 2018-10-29 | CVE-2018-11871 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Buffer overwrite can happen in WLAN function while processing set pdev parameter command due to lack of input validation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version IPQ4019, IPQ8064, IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016. | 7.2 |
| 2018-10-29 | CVE-2018-11866 | Integer Overflow or Wraparound vulnerability in Qualcomm products Integer overflow may happen in WLAN when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | 7.2 |
| 2018-10-29 | CVE-2018-11865 | Integer Overflow or Wraparound vulnerability in Qualcomm products Integer overflow may happen when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | 7.2 |