Vulnerabilities > Qualcomm > Sdm630 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-05-24 | CVE-2018-11928 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Lack of check on length parameter may cause buffer overflow while processing WMI commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCS605, SD 210/SD 212/SD 205, SD 425, SD 600, SD 625, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SDX20, SDX24, SM7150, SXR1130 | 7.8 |
| 2019-05-24 | CVE-2018-11925 | Integer Overflow or Wraparound vulnerability in Qualcomm products Data length received from firmware is not validated against the max allowed size which can result in buffer overflow. | 7.8 |
| 2019-05-24 | CVE-2018-11924 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper buffer length validation in WLAN function can lead to a potential integer oveflow issue in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24, SM7150 | 7.8 |
| 2019-05-24 | CVE-2018-11923 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper buffer length check before copying can lead to integer overflow and then a buffer overflow in WMA event handler in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24 | 7.8 |
| 2019-05-24 | CVE-2018-11271 | Improper Authentication vulnerability in Qualcomm products Improper authentication can happen on Remote command handling due to inappropriate handling of events in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SM7150, Snapdragon_High_Med_2016, SXR1130 | 9.8 |
| 2019-05-06 | CVE-2017-18279 | Integer Overflow or Wraparound vulnerability in Qualcomm products Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016. | 7.8 |
| 2019-05-06 | CVE-2017-18173 | Integer Overflow or Wraparound vulnerability in Qualcomm products In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. | 7.8 |
| 2019-05-06 | CVE-2017-18131 | Improper Initialization vulnerability in Qualcomm products In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | 7.8 |
| 2019-04-04 | CVE-2018-11971 | Information Exposure vulnerability in Qualcomm products Interrupt exit code flow may undermine access control policy set forth by secure world can lead to potential secure asset leakage in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 410/12, SD 615/16/SD 415, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SD 8CX, SDA660, SDM630, SDM660, SXR1130 | 5.5 |
| 2019-04-04 | CVE-2018-11970 | Unspecified vulnerability in Qualcomm products TZ App dynamic allocations not protected from XBL loader in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SD 8CX, SDA660, SDM630, SDM660, SXR1130 | 7.8 |