Vulnerabilities > Qualcomm > Sd855 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-01-09 | CVE-2022-33284 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in WLAN while parsing BTM action frame. | 6.5 |
| 2023-01-09 | CVE-2022-33285 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames. | 6.5 |
| 2023-01-09 | CVE-2022-33286 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames. | 6.5 |
| 2023-01-09 | CVE-2022-40516 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core due to stack-based buffer overflow. | 7.8 |
| 2023-01-09 | CVE-2022-40517 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in core due to stack-based buffer overflow | 7.8 |
| 2023-01-09 | CVE-2022-40518 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer overread in Core | 5.5 |
| 2023-01-09 | CVE-2022-40519 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer overread in Core | 5.5 |
| 2023-01-09 | CVE-2022-40520 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to stack-based buffer overflow in Core | 7.8 |
| 2022-12-13 | CVE-2022-25675 | Reachable Assertion vulnerability in Qualcomm products Denial of service due to reachable assertion in modem while processing filter rule from application client in Snapdragon Compute, Snapdragon Industrial IOT, Snapdragon Mobile | 5.5 |
| 2022-12-13 | CVE-2022-25677 | Use After Free vulnerability in Qualcomm products Memory corruption in diag due to use after free while processing dci packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |