Vulnerabilities > Qualcomm > Sd675 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-09-02 | CVE-2022-22080 | Out-of-bounds Write vulnerability in Qualcomm products Improper validation of backend id in PCM routing process can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |
| 2022-06-14 | CVE-2021-30281 | Unspecified vulnerability in Qualcomm products Possible unauthorized access to secure space due to improper check of data allowed while flashing the no access control device configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-06-14 | CVE-2021-30334 | Use After Free vulnerability in Qualcomm products Possible use after free due to lack of null check of DRM file status after file structure is freed in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2021-30344 | Unspecified vulnerability in Qualcomm products Improper authorization of a replayed LTE security mode command can lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2021-30347 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? right after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 8.1 |
| 2022-06-14 | CVE-2021-30350 | Improper Validation of Specified Quantity in Input vulnerability in Qualcomm products Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2021-35078 | Memory Leak vulnerability in Qualcomm products Possible memory leak due to improper validation of certificate chain length while parsing server certificate chain in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2021-35094 | Improper Authentication vulnerability in Qualcomm products Improper verification of timeout-based authentication in identity credential can lead to invalid authorization in HLOS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-06-14 | CVE-2021-35100 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to improper calculation of string length while parsing Id3 tag in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2021-35102 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of validation for the length of NAI string read from EFS in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile | 7.8 |