Vulnerabilities > Qualcomm > Sd670 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-06-09 | CVE-2020-11261 | Improper Input Validation vulnerability in Qualcomm products Memory corruption due to improper check to return error when user application requests memory allocation of a huge size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2021-06-09 | CVE-2020-11262 | Use After Free vulnerability in Qualcomm products A race between command submission and destroying the context can cause an invalid context being added to the list leads to use after free issue. | 7.0 |
2021-05-07 | CVE-2020-11279 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while processing crafted SDES packets due to improper length check in sdes packets recieved in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
2021-05-07 | CVE-2020-11285 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read while unpacking the RTCP packet we may read extra byte if wrong length is provided in RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
2021-05-07 | CVE-2020-11288 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Out of bound write can occur in playready while processing command due to lack of input validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |
2021-05-07 | CVE-2020-11289 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Out of bound write can occur in TZ command handler due to lack of validation of command ID in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-05-07 | CVE-2020-11293 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.0 |
2021-05-07 | CVE-2020-11295 | Use After Free vulnerability in Qualcomm products Use after free in camera If the threadmanager is being cleaned up while the worker thread is processing objects in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
2021-05-07 | CVE-2021-1891 | Use After Free vulnerability in Qualcomm products A possible use-after-free occurrence in audio driver can happen when pointers are not properly handled in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-05-07 | CVE-2021-1895 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow due to improper length check while flashing an image in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music | 7.8 |