Vulnerabilities > Qualcomm > Sd670 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-09-09 | CVE-2021-30295 | Classic Buffer Overflow vulnerability in Qualcomm products Possible heap overflow due to improper validation of local variable while storing current task information locally in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.2 |
| 2021-09-08 | CVE-2020-11301 | Improper Authentication vulnerability in Qualcomm products Improper authentication of un-encrypted plaintext Wi-Fi frames in an encrypted network can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.0 |
| 2021-09-08 | CVE-2021-1904 | Incorrect Comparison vulnerability in Qualcomm products Child process can leak information from parent process due to numeric pids are getting compared and these pid can be reused in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 2.1 |
| 2021-09-08 | CVE-2021-1914 | Infinite Loop vulnerability in Qualcomm products Loop with unreachable exit condition may occur due to improper handling of unsupported input in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 5.0 |
| 2021-09-08 | CVE-2021-1916 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer underflow due to lack of check for negative indices values when processing user provided input in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
| 2021-09-08 | CVE-2021-1919 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur when the RTCP length is lesser than than the actual blocks present in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
| 2021-09-08 | CVE-2021-1920 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur due to improper handling of incoming RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
| 2021-09-08 | CVE-2021-1923 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Incorrect pointer argument passed to trusted application TA could result in un-intended memory operations in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT | 4.6 |
| 2021-09-08 | CVE-2021-1930 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Possible out of bounds read due to incorrect validation of incoming buffer length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 3.6 |
| 2021-09-08 | CVE-2021-1972 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of device types during P2P search in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 10.0 |