Vulnerabilities > Qualcomm > Sd662 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-11-12 | CVE-2021-1973 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products A FTM Diag command can allow an arbitrary write into modem OS space in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2021-11-12 | CVE-2021-1975 | Out-of-bounds Write vulnerability in Qualcomm products Possible heap overflow due to improper length check of domain while parsing the DNS response in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
| 2021-11-12 | CVE-2021-30254 | Improper Input Validation vulnerability in Qualcomm products Possible buffer overflow due to improper input validation in factory calibration and test DIAG command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2021-11-12 | CVE-2021-30255 | Improper Validation of Array Index vulnerability in Qualcomm products Possible buffer overflow due to improper input validation in PDM DIAG command in FTM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2021-11-12 | CVE-2021-30259 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound access due to improper validation of function table entries in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2021-11-12 | CVE-2021-30264 | Use After Free vulnerability in Qualcomm products Possible use after free due improper validation of reference from call back to internal store table in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2021-11-12 | CVE-2021-30265 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to improper validation of memory address while processing user-space IOCTL for clearing Filter and Route statistics in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
| 2021-11-12 | CVE-2021-30266 | Use After Free vulnerability in Qualcomm products Possible use after free due to improper memory validation when initializing new interface via Interface add command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2021-11-12 | CVE-2021-30284 | Information Exposure vulnerability in Qualcomm products Possible information exposure and denial of service due to NAS not dropping messages when integrity check fails in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.4 |
| 2021-10-20 | CVE-2021-1913 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow due to improper length check while updating grace period and count record in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.2 |