Vulnerabilities > Qualcomm > Sd625 Firmware > Critical
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-08-08 | CVE-2022-40510 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder. | 9.8 |
2023-03-10 | CVE-2022-40537 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in Bluetooth HOST while processing the AVRC_PDU_GET_PLAYER_APP_VALUE_TEXT AVRCP response. | 9.8 |
2023-03-10 | CVE-2022-40515 | Double Free vulnerability in Qualcomm products Memory corruption in Video due to double free while playing 3gp clip with invalid metadata atoms. | 9.8 |
2018-09-20 | CVE-2017-18314 | Unspecified vulnerability in Qualcomm products In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, on TZ cold boot the CNOC_QDSS RG0 locked by xBL_SEC is cleared by TZ. | 9.8 |
2018-09-20 | CVE-2018-11287 | Improper Input Validation vulnerability in Qualcomm products In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, incorrect control flow implementation in Video while checking buffer sufficiency. | 9.8 |