Vulnerabilities > Qualcomm > SD 8CX Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-09-16 | CVE-2022-22093 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption or temporary denial of service due to improper handling of concurrent hypervisor operations to attach or detach IRQs from virtual interrupt sources in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2022-09-16 | CVE-2022-22094 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products memory corruption in Kernel due to race condition while getting mapping reference in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2022-09-16 | CVE-2022-25690 | Improper Validation of Array Index vulnerability in Qualcomm products Information disclosure in WLAN due to improper validation of array index while parsing crafted ANQP action frames in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.5 |
| 2022-09-02 | CVE-2021-35122 | Improper Input Validation vulnerability in Qualcomm products Non-secure region can try modifying RG permissions of IO space xPUs due to improper input validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.8 |
| 2022-09-02 | CVE-2022-22070 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in audio due to lack of check of invalid routing address into APR Routing table in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2021-35078 | Memory Leak vulnerability in Qualcomm products Possible memory leak due to improper validation of certificate chain length while parsing server certificate chain in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2021-35090 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Possible hypervisor memory corruption due to TOC TOU race condition when updating address mappings in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-01-03 | CVE-2021-1894 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products Improper access control in TrustZone due to improper error handling while handling the signing key in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30267 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow to buffer overflow due to improper input validation in FTM ARA commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-01-03 | CVE-2021-30268 | Classic Buffer Overflow vulnerability in Qualcomm products Possible heap Memory Corruption Issue due to lack of input validation when sending HWTC IQ Capture command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |