Vulnerabilities > Qualcomm > SD 820A Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-05-24 | CVE-2018-11928 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Lack of check on length parameter may cause buffer overflow while processing WMI commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCS605, SD 210/SD 212/SD 205, SD 425, SD 600, SD 625, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SDX20, SDX24, SM7150, SXR1130 | 7.8 |
| 2019-05-24 | CVE-2018-11927 | Improper Validation of Array Index vulnerability in Qualcomm products Improper input validation on input which is used as an array index will lead to an out of bounds issue while processing AP find event from firmware in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, SD 210/SD 212/SD 205, SD 625, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 845 / SD 850, SD 855, SDX20, SDX24, SM7150 | 7.8 |
| 2019-05-24 | CVE-2018-11924 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper buffer length validation in WLAN function can lead to a potential integer oveflow issue in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24, SM7150 | 7.8 |
| 2019-05-24 | CVE-2018-11923 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper buffer length check before copying can lead to integer overflow and then a buffer overflow in WMA event handler in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24 | 7.8 |
| 2019-05-06 | CVE-2017-18278 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850. | 7.8 |
| 2019-05-06 | CVE-2017-18274 | Improper Validation of Array Index vulnerability in Qualcomm products While iterating through the models contained in a fixed-size array in the actData structure, which also stores an incorrect number of models that is greater than the size of the array, a buffer overflow occurs in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835 | 7.8 |
| 2019-05-06 | CVE-2017-18157 | Use After Free vulnerability in Qualcomm products A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20. | 7.8 |
| 2019-05-06 | CVE-2017-18156 | Use After Free vulnerability in Qualcomm products While processing camera buffers in camera driver, a use after free condition can occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, SDX20. | 7.8 |
| 2019-05-06 | CVE-2017-18131 | Improper Initialization vulnerability in Qualcomm products In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | 7.8 |
| 2019-04-04 | CVE-2018-13918 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products kernel could return a received message length higher than expected, which leads to buffer overflow in a subsequent operation and stops normal operation in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, in MDM9150, MDM9206, MDM9607, MDM9650, MSM8909W, QCS605, Qualcomm 215, SD 425, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDX24, SM7150 | 7.8 |