Vulnerabilities > Qualcomm > SD 650 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2018-10-23 | CVE-2017-18293 | Unspecified vulnerability in Qualcomm products When a particular GPIO is protected by blocking access to the corresponding GPIO resource registers, the protection can be bypassed using the corresponding banked GPIO registers instead in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 835, SDA660. | 7.2 |
2018-10-23 | CVE-2017-18292 | Improper Input Validation vulnerability in Qualcomm products Secure app running in non secure space can restart TZ by calling Widevine app API repeatedly in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A. | 4.9 |
2018-10-23 | CVE-2017-18277 | Infinite Loop vulnerability in Qualcomm products When dynamic memory allocation fails, currently the process sleeps for one second and continues with infinite loop without retrying for memory allocation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, QCN5502, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835. | 4.9 |
2018-10-23 | CVE-2017-18172 | Integer Overflow or Wraparound vulnerability in Qualcomm products In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. | 7.2 |
2018-10-23 | CVE-2017-18171 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Improper input validation for GATT data packet received in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | 8.3 |
2018-10-23 | CVE-2017-18170 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | 8.3 |
2018-07-06 | CVE-2018-5894 | Out-of-bounds Read vulnerability in Qualcomm products Improper Validation of Array Index in Multimedia While parsing an mp4 file in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, an out-of-bounds access can occur. | 4.3 |
2018-07-06 | CVE-2018-5892 | Information Exposure vulnerability in Qualcomm products The Touch Pal application can collect user behavior data without awareness by the user in Snapdragon Mobile and Snapdragon Wear. | 5.0 |
2018-07-06 | CVE-2018-5891 | Use After Free vulnerability in Qualcomm products While processing modem SSR after IMS is registered, the IMS data daemon is restarted but the ipc_dataHandle is no longer available. | 4.6 |
2018-07-06 | CVE-2018-5882 | Out-of-bounds Read vulnerability in Qualcomm products While parsing a Flac file with a corrupted comment block, a buffer over-read can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear. | 7.5 |