Vulnerabilities > Qualcomm > SD 636 Firmware > High
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-10-20 | CVE-2021-30256 | Out-of-bounds Write vulnerability in Qualcomm products Possible stack overflow due to improper validation of camera name length before copying the name in VR Service in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.2 |
2021-10-20 | CVE-2021-30257 | Out-of-bounds Write vulnerability in Qualcomm products Possible out of bound read or write in VR service due to lack of validation of DSP selection values in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.2 |
2021-10-20 | CVE-2021-30258 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer overflow due to improper size calculation of payload received in VR service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
2021-10-20 | CVE-2021-30291 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
2021-10-20 | CVE-2021-30292 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
2021-09-17 | CVE-2021-30261 | Improper Input Validation vulnerability in Qualcomm products Possible integer and heap overflow due to lack of input command size validation while handling beacon template update command from HLOS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
2021-09-09 | CVE-2021-1909 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow occurs in trusted applications due to lack of length check of parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |
2021-09-09 | CVE-2021-1934 | Double Free vulnerability in Qualcomm products Possible memory corruption due to improper check when application loader object is explicitly destructed while application is unloading in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.2 |
2021-09-09 | CVE-2021-1941 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read issue due to improper length check on WPA IE string sent by peer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
2021-09-09 | CVE-2021-1948 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to lack of length check of data while parsing the beacon or probe response in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |