Vulnerabilities > Qualcomm > SD 636 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-10-20 | CVE-2021-30257 | Out-of-bounds Write vulnerability in Qualcomm products Possible out of bound read or write in VR service due to lack of validation of DSP selection values in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.2 |
| 2021-10-20 | CVE-2021-30258 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer overflow due to improper size calculation of payload received in VR service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
| 2021-10-20 | CVE-2021-30291 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
| 2021-10-20 | CVE-2021-30292 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption due to lack of validation of client data used for memory allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.2 |
| 2021-10-20 | CVE-2021-30297 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound read due to improper validation of packet length while handling data transfer in VR service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 3.6 |
| 2021-09-17 | CVE-2021-1976 | Use After Free vulnerability in Qualcomm products A use after free can occur due to improper validation of P2P device address in PD Request frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 10.0 |
| 2021-09-17 | CVE-2021-30260 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible Integer overflow to buffer overflow issue can occur due to improper validation of input parameters when extscan hostlist configuration command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 4.6 |
| 2021-09-17 | CVE-2021-30261 | Improper Input Validation vulnerability in Qualcomm products Possible integer and heap overflow due to lack of input command size validation while handling beacon template update command from HLOS in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
| 2021-09-09 | CVE-2021-1909 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow occurs in trusted applications due to lack of length check of parameters in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2021-09-09 | CVE-2021-1933 | Improper Validation of Array Index vulnerability in Qualcomm products UE assertion is possible due to improper validation of invite message with SDP body in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 10.0 |