Vulnerabilities > Qualcomm > Sa9000P Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-02-06 | CVE-2023-33065 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Audio while accessing AVCS services from ADSP payload. | 7.1 |
2024-01-02 | CVE-2023-33030 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in HLOS while running playready use-case. | 7.8 |
2024-01-02 | CVE-2023-33036 | NULL Pointer Dereference vulnerability in Qualcomm products Permanent DOS in Hypervisor while untrusted VM without PSCI support makes a PSCI call. | 5.5 |
2024-01-02 | CVE-2023-33037 | Missing Encryption of Sensitive Data vulnerability in Qualcomm products Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. | 5.5 |
2023-12-05 | CVE-2023-22668 | Use After Free vulnerability in Qualcomm products Memory Corruption in Audio while invoking IOCTLs calls from the user-space. | 7.8 |
2023-12-05 | CVE-2023-28546 | Classic Buffer Overflow vulnerability in Qualcomm products Memory Corruption in SPS Application while exporting public key in sorter TA. | 7.8 |
2023-12-05 | CVE-2023-28550 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in MPP performance while accessing DSM watermark using external memory address. | 7.8 |
2023-12-05 | CVE-2023-28585 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption while loading an ELF segment in TEE Kernel. | 8.8 |
2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
2023-12-05 | CVE-2023-28587 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level. | 7.8 |