Vulnerabilities > Qualcomm > Sa9000P Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2023-21632 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Automotive GPU while querying a gsl memory node. | 7.8 |
| 2023-05-02 | CVE-2022-33273 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Trusted Execution Environment while QRKS report generation. | 5.5 |
| 2023-05-02 | CVE-2022-25713 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Automotive due to Improper Restriction of Operations within the Bounds of a Memory Buffer while exporting a shared key. | 7.8 |
| 2023-05-02 | CVE-2023-21642 | Unspecified vulnerability in Qualcomm products Memory corruption in HAB Memory management due to broad system privileges via physical address. | 7.8 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
| 2023-04-13 | CVE-2022-33269 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment. | 7.8 |
| 2023-04-13 | CVE-2022-33282 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in Automotive Multimedia due to integer overflow to buffer overflow during IOCTL calls in video playback. | 7.8 |
| 2023-04-13 | CVE-2022-33288 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information. | 8.8 |
| 2023-03-10 | CVE-2022-33242 | Improper Authentication vulnerability in Qualcomm products Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD. | 7.8 |
| 2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |