Vulnerabilities > Qualcomm > Sa6155P Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-09-02 | CVE-2021-35097 | Improper Verification of Cryptographic Signature vulnerability in Qualcomm products Possible authentication bypass due to improper order of signature verification and hashing in the signature verification call in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.8 |
| 2022-09-02 | CVE-2021-35135 | NULL Pointer Dereference vulnerability in Qualcomm products A null pointer dereference may potentially occur during RSA key import in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
| 2022-09-02 | CVE-2022-22101 | Resource Exhaustion vulnerability in Qualcomm products Denial of service in multimedia due to uncontrolled resource consumption while parsing an incoming HAB message in Snapdragon Auto | 5.5 |
| 2022-06-14 | CVE-2021-30342 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Improper integrity check can lead to race condition between tasks PDCP and RRC? after a valid RRC Command packet has been received in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 5.9 |
| 2022-06-14 | CVE-2021-30349 | Unspecified vulnerability in Qualcomm products Improper access control sequence for AC database after memory allocation can lead to possible memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2022-06-14 | CVE-2021-35071 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2022-06-14 | CVE-2021-35118 | Out-of-bounds Write vulnerability in Qualcomm products An out-of-bounds write can occur due to an incorrect input check in the camera driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2022-06-14 | CVE-2021-35119 | Out-of-bounds Read vulnerability in Qualcomm products Potential out of Bounds read in FIPS event processing due to improper validation of the length from the firmware in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 5.5 |
| 2022-06-14 | CVE-2021-35120 | Use After Free vulnerability in Qualcomm products Improper handling between export and release functions on the same handle from client can lead to use after free in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |
| 2022-02-11 | CVE-2021-30324 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |