Vulnerabilities > Qualcomm > Sa6155P Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-04-13 CVE-2022-33288 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information.
local
low complexity
qualcomm CWE-120
8.8
2023-04-13 CVE-2022-33298 Use After Free vulnerability in Qualcomm products
Memory corruption due to use after free in Modem while modem initialization.
local
low complexity
qualcomm CWE-416
7.8
2023-04-13 CVE-2022-33301 Incorrect Type Conversion or Cast vulnerability in Qualcomm products
Memory corruption due to incorrect type conversion or cast in audio while using audio playback/capture when crafted address is sent from AGM IPC to AGM.
local
low complexity
qualcomm CWE-704
7.8
2023-04-13 CVE-2022-40503 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming.
network
low complexity
qualcomm CWE-125
7.5
2023-04-13 CVE-2022-40532 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target.
local
low complexity
qualcomm CWE-190
7.8
2023-04-13 CVE-2023-21630 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory Corruption in Multimedia Framework due to integer overflow when synx bind is called along with synx signal.
local
low complexity
qualcomm CWE-190
7.8
2023-03-10 CVE-2022-25655 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in WLAN HAL while arbitrary value is passed in WMI UTF command payload.
local
low complexity
qualcomm CWE-120
7.8
2023-03-10 CVE-2022-33242 Improper Authentication vulnerability in Qualcomm products
Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD.
local
low complexity
qualcomm CWE-287
7.8
2023-03-10 CVE-2022-33245 Use After Free vulnerability in Qualcomm products
Memory corruption in WLAN due to use after free
local
low complexity
qualcomm CWE-416
7.8
2023-03-10 CVE-2022-33257 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone.
local
high complexity
qualcomm CWE-367
7.0